US Patent Issued to MURATA MANUFACTURING on Aug. 26 for "High-frequency module, communication device, and method for manufacturing plurality of high-frequency modules" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,244, issued on Aug. 26, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"High-frequency module, communication device, and method for manufacturing plurality of high-frequency modules" was invented by Takanori Uejima (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high-frequency module includes: a module board that has main surfaces which are opposed to each other; a plurality of high-frequency components that are arranged on at least one of the main surfaces; a resin member that covers at least one of the main surfaces and has a plurality of side surfaces along an outer edge of the module board; and a shield electrode la...