ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,395,074, issued on Aug. 19, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan).
"Power semiconductor package" was invented by David Giuliano (San Diego).
According to the abstract* released by the U.S. Patent & Trademark Office: "Subject matter disclosed herein may relate to semiconductor devices, and may more particularly relate to power semiconductor packages, for example."
The patent was filed on Feb. 26, 2024, under Application No. 18/587,418.
*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=12395074&OS...