US Patent Issued to MURATA MANUFACTURING on Aug. 19 for "Electronic component, module, and method of manufacturing electronic component" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,725, issued on Aug. 19, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto-Fu, Japan).

"Electronic component, module, and method of manufacturing electronic component" was invented by Ryohei Okabe (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component includes an electronic component main body including a first surface, a signal bump electrode arranged on the first surface to protrude from the first surface of the electronic component main body, and a protective film provided with an opening through which a part of the signal bump electrode is exposed, the protective film being arranged to cover a portion of the ...