ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,396,094, issued on Aug. 19, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Circuit substrate and module" was invented by Hisashi Suzuki (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board 1 including: a substrate; an electrode pad on a surface of the substrate; and a projecting electrode on the electrode pad, wherein the electrode pad on which the projecting electrode is disposed is larger than the projecting electrode when viewed from above, and a coating layer covers at least a portion of an outer periphery of the electrode pad on which the projecting electrode is disposed."
The patent was filed on March 24, 2...