ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,389,539, issued on Aug. 12, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Wiring board and module" was invented by Issei Yamamoto (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Wiring board includes rigid board and flexible board laminated on rigid board. Cavity recessed in thickness direction of rigid board is formed in surface of rigid board which is located on flexible board side. Side surface and bottom surface of cavity are formed of rigid board. Top surface of cavity is formed of flexible board."
The patent was filed on Sept. 1, 2023, under Application No. 18/459,949.
*For further information, including images...