US Patent Issued to MURATA MANUFACTURING on Aug. 12 for "High frequency module and communication apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,473, issued on Aug. 12, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"High frequency module and communication apparatus" was invented by Hiroyuki Kani (Kyoto, Japan) and Takuma Kuroyanagi (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The total sum of wiring lengths between reception filters and low-noise amplifiers is reduced. A high frequency module includes a mounting board, a plurality of inductors, a plurality of reception filters, and an IC component. The plurality of inductors are mounted on a first main surface of the mounting board. The plurality of reception filters are mounted on the first main surface of th...