US Patent Issued to MURATA MANUFACTURING on April 8 for "Multi-layer signal transmission line including a void of specified dimensions and method for manufacture" (Japanese Inventor)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,856, issued on April 8, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Multi-layer signal transmission line including a void of specified dimensions and method for manufacture" was invented by Yushi Soeta (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A conductor non-formed portion where no conductor layer exists is provided in a first ground conductor layer. A multilayer body is provided with a void where no insulating resin exists. At least a portion of the conductor non-formed portion is provided in a first area positioned at a right of a first interlayer connection conductor with respect to a multilayer body le...