US Patent Issued to MURATA MANUFACTURING on April 29 for "Multilayer resin substrate and method of manufacturing multilayer resin substrate" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,637, issued on April 29, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Multilayer resin substrate and method of manufacturing multilayer resin substrate" was invented by Rintaro Sugi (Nagaokakyo, Japan) and Keisuke Araki (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer resin substrate includes a stacked body, and a coil including a first coil conductor pattern and a second coil conductor pattern. The second coil conductor pattern includes a wide portion with a line width larger than a line width of the first coil conductor pattern. The wide portion includes overlapping portions that overlap with the firs...