US Patent Issued to MURATA MANUFACTURING on April 29 for "Multilayer resin substrate and electronic component" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,826, issued on April 29, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Multilayer resin substrate and electronic component" was invented by Takako Sato (Nagaokakyo, Japan) and Hiroki Maegawa (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer resin substrate includes insulating resin base material layers, and conductor patterns on at least one of the insulating resin base material layers. The conductor patterns include a ground conductor on a main surface of the insulating resin base material layers and extend into a frame shape or a planar shape, and the ground conductor includes openings. An aperture rati...