US Patent Issued to Murata Manufacturing on April 22 for "Radio-frequency module and communication apparatus" (Japanese Inventor)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,760, issued on April 22, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan).

"Radio-frequency module and communication apparatus" was invented by Koji Furutani (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A radio-frequency module includes a multilayer substrate, a first semiconductor device, a second semiconductor device, a first mold layer, and a second mold layer. The multilayer substrate includes a plurality of stacked layers, and has a first major face and a second major face. The first mold layer seals the first semiconductor device. The second mold layer seals the second semiconductor device. The first major face inclu...