ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,197, issued on April 15, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).
"Package board" was invented by Kenji Nishiyama (Nagaokakyo, Japan), Koshi Himeda (Nagaokakyo, Japan) and Yoshimitsu Ushimi (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package board that includes an inductor layer having: a first magnetic layer including first magnetic particles and a resin; an inductor wiring that functions as an inductor in the first magnetic layer; and a second magnetic layer on at least one surface of the first magnetic layer, including second magnetic particles that are higher in average flatness than the first mag...