US Patent Issued to Murata Manufacturing on April 15 for "Circuit module and method for manufacturing submodule" (Japanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,279,374, issued on April 15, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan).

"Circuit module and method for manufacturing submodule" was invented by Yoshihito Otsubo (Nagaokakyo, Japan) and Minoru Hatase (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit module includes: a main substrate; a submodule that is mounted on a top surface of the main substrate; a main sealing resin that is provided on the top surface of the main substrate, and covers at least part of the submodule; and a conductive shield film that covers at least part of the main sealing resin. The submodule includes a sub-substrate, an electronic part t...