US Patent Issued to MURATA MANUFACTURING on April 1 for "Electronic component module and method for manufacturing electronic component module" (Japanese Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,267,964, issued on April 1, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto-fu, Japan).

"Electronic component module and method for manufacturing electronic component module" was invented by Toru Komatsu (Nagaokakyo, Japan) and Tadashi Nomura (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component module includes a plurality of components having terminals and arranged along a plane, a sealing resin portion that covers and seals these components and has a plane as one plane of an outer surface, and a shield layer that covers the outer surface of the sealing resin portion. Terminals of the plurality of components are...