US Patent Issued to MTAL on Jan. 13 for "Semiconductor module" (Swiss Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,527, issued on Jan. 13, was assigned to MTAL GMBH (Gaensbrunnen, Switzerland).

"Semiconductor module" was invented by Munaf Rahimo (Solothurn, Switzerland) and Ulrich Schlapbach (Bern, Switzerland).

According to the abstract* released by the U.S. Patent & Trademark Office: "A module arrangement for power semiconductor devices, includes two or more heat spreading layers with a first surface and a second surface being arranged opposite to the first surface. At least two or more power semiconductor devices are arranged on the first surface of the heat spreading layer and electrically connected thereto. An electrical isolation stack comprising an electrically insulating layer and ele...