US Patent Issued to Motorola Mobility on April 22 for "Electronic device housing with insert molded features and methods of constructing the same" (Illinois Inventor)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,284,299, issued on April 22, was assigned to Motorola Mobility LLC (Chicago).

"Electronic device housing with insert molded features and methods of constructing the same" was invented by Byoungkwan Sohn (Arlington Heights, Ill.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A component for an electronic device include a housing and a plastic substrate. The plastic substrate is disposed in, and adjacent to, the housing, A thermoplastic overlayer is insert molded into the housing. The plastic substrate is disposed between the housing and the thermoplastic overlayer after the insert molding. The plastic substrate and the thermoplastic overlayer can share at...