ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,558, issued on April 22, was assigned to MOTOR SEMICONDUCTOR Co. LTD. (Hsinchu County, Taiwan).
"Half-bridge circuit package structure" was invented by Kuo-Lun Huang (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A half-bridge circuit package structure includes a chip pad, a first metal island, a driving chip, an upper bridge switch, and a lower bridge switch. The driving chip includes a ground pad and a high side ground pad. The upper bridge switch includes a first enhancement mode transistor and a first depletion mode transistor. A drain pad of the first depletion mode transistor is electrically connected to the first metal island....