ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,277, issued on July 22, was assigned to Motivair Corp. (Lancaster, N.Y.).
"Cooling apparatus with offset flow paths" was invented by Rich S. Whitmore (East Amherst, N.Y.) and Timothy A Shedd (Lithia, Fla.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling apparatus for an electronic or computing device includes a base for thermal coupling to a surface of the electronic or computing device and a cover spaced from the base. A nozzle plate is disposed between the base and the cover to partially define an inlet volume and an outlet volume. Cooling fluid enters the inlet volume and passes through the nozzle plate to the outlet volume and out of the...