US Patent Issued to MOSAIC MICROSYSTEMS on May 6 for "Facilitating formation of a via in a substrate" (New York Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,926, issued on May 6, was assigned to MOSAIC MICROSYSTEMS LLC (Rochester, N.Y.).

"Facilitating formation of a via in a substrate" was invented by Shelby Forrester Nelson (Pittsford, N.Y.) and David Howard Levy (Rochester, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An inorganic substrate with an improved via shape and methods for facilitating formation of such improved via shape are disclosed. A double-sided opening process may be applied to an inorganic substrate to form openings at the ends of a damage track previously formed in the inorganic substrate. One side of the inorganic substrate may then be sealed, such as by being temporarily bo...