US Patent Issued to Monolithic 3D on Sept. 30 for "3D semiconductor devices and structures with electronic circuit units" (American, Israeli Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,433,031, issued on Sept. 30, was assigned to Monolithic 3D Inc. (Allen, Texas).

"3D semiconductor devices and structures with electronic circuit units" was invented by Zvi Or-Bach (Haifa, Israel), Jin-Woo Han (San Jose, Calif.) and Brian Cronquist (Klamath Falls, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D device including: a first level including first transistors and a first interconnect; a second level including second transistors and overlaying the first level; at least four electronic circuit units (ECUs); a redundancy circuit, where each of the at least four ECUs includes a first circuit, which includes a portion of the first transis...