US Patent Issued to Monolithic 3D on Nov. 18 for "Automation methods for 3D integrated circuits and devices" (American, Israeli Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,475,294, issued on Nov. 18, was assigned to Monolithic 3D Inc. (Allen, Texas).

"Automation methods for 3D integrated circuits and devices" was invented by Zvi Or-Bach (Haifa, Israel) and Zeev Wurman (Palo Alto, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of designing a 3D Integrated Circuit including: partitioning at least one design into at least two levels, a first level and a second level, where the first level includes first transistors, where the second level includes second transistors and is disposed on top of the first level; levels connection pads (LCPs) disposed between the first level and second level; providing placement o...