US Patent Issued to Monolithic 3D on Nov. 18 for "3D semiconductor devices and structures with slits" (Israeli, American Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,475,952, issued on Nov. 18, was assigned to Monolithic 3D Inc. (Klamath Falls, Ore.).

"3D semiconductor devices and structures with slits" was invented by Zvi Or-Bach (Haifa, Israel), Jin-Woo Han (San Jose, Calif.) and Eli Lusky (Ramat Gan, Israel).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device including: a first level including memory control circuits (include a plurality of refresh circuits for the memory units) which include first transistors; a second level including a first array of memory cells including second transistors self-aligned to at least one of the third transistors; a third level disposed on top of the second level...