US Patent Issued to Monolithic 3D on July 29 for "3D semiconductor devices and structures with metal layers" (American, Israeli Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,382, issued on July 29, was assigned to Monolithic 3D Inc. (Klamath Falls, Ore.).

"3D semiconductor devices and structures with metal layers" was invented by Zvi Or-Bach (Haifa, Israel) and Brian Cronquist (Klamath Falls, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device including: a first level including a first single crystal silicon layer, a plurality of first transistors, and input/output circuits; a first metal layer; a second metal layer which includes a power delivery network; where interconnection of the plurality of first transistors includes the first and second metal layers; a second level including a plurality of...