US Patent Issued to Monolithic 3D on July 22 for "3D semiconductor device, structure and methods with memory arrays and connectivity structures" (American, Israeli Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,323, issued on July 22, was assigned to Monolithic 3D Inc. (Klamath Falls, Ore.).

"3D semiconductor device, structure and methods with memory arrays and connectivity structures" was invented by Zvi Or-Bach (Haifa, Israel), Jin-Woo Han (San Jose, Calif.), Brian Cronquist (Klamath Falls, Ore.) and Eli Lusky (Ramat-Gan, Israel).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D semiconductor device including dicing including an etch process; and including: a first level including a single crystal layer, and a memory control circuit which includes first transistors; a first metal layer overlaying the first single crystal layer; a second metal layer over...