US Patent Issued to Monolithic 3D on July 15 for "Multilevel semiconductor device and structure with oxide bonding" (American, Israeli Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,360,310, issued on July 15, was assigned to Monolithic 3D Inc. (Klamath Falls, Ore.).

"Multilevel semiconductor device and structure with oxide bonding" was invented by Zvi Or-Bach (Haifa, Israel), Deepak C. Sekar (Sunnyvale, Calif.) and Brian Cronquist (Klamath Falls, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-level semiconductor device, the device comprising: a first level comprising integrated circuits; a second level comprising at least one electromagnetic wave receiver, wherein said second level is disposed above said first level, wherein said integrated circuits comprise single crystal transistors; and an oxide layer disposed betw...