US Patent Issued to Monolithic 3D on July 15 for "3D semiconductor device and structure with connection paths" (American, Israeli Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,330, issued on July 15, was assigned to Monolithic 3D Inc. (Klamath Falls, Ore.).

"3D semiconductor device and structure with connection paths" was invented by Zvi Or-Bach (Haifa, Israel) and Brian Cronquist (Klamath Falls, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D semiconductor device, the device including: a first level, where the first level includes a first layer, the first layer including first transistors, and where the first level includes a second layer, the second layer including first interconnections; a second level overlaying the first level, where the second level includes a plurality of second transistors, where the seco...