US Patent Issued to Monolithic 3D on July 15 for "3D semiconductor device and structure including power distribution grids" (American, Israeli Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,222, issued on July 15, was assigned to Monolithic 3D Inc. (Klamath Falls, Ore.).

"3D semiconductor device and structure including power distribution grids" was invented by Zvi Or-Bach (Haifa, Israel), Brian Cronquist (Klamath Falls, Ore.) and Deepak Sekar (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D device includes a first level including a first single crystal layer with control circuitry which includes first single crystal transistors; a first metal layer atop first single crystal layer; a second, third, and fourth metal layer providing connections between the first transistors; at least one second level (includes a plur...