US Patent Issued to Monolithic 3D on Aug. 19 for "Multilevel semiconductor device and structure with image sensors and wafer bonding" (American, Israeli Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,396,284, issued on Aug. 19, was assigned to Monolithic 3D Inc. (Klamath Falls, Ore.).

"Multilevel semiconductor device and structure with image sensors and wafer bonding" was invented by Zvi Or-Bach (Haifa, Israel), Deepak C. Sekar (Sunnyvale, Calif.) and Brian Cronquist (Klamath Falls, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated device, the device including: a first level including a first mono-crystal layer, the first mono-crystal layer including a plurality of single crystal transistors; an overlying oxide disposed on top of the first level; a second level including a second mono-crystal layer, the second level overlaying the ox...