US Patent Issued to Monolithic 3D on Aug. 12 for "3D semiconductor device and structure with logic and memory" (American, Israeli Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,389,602, issued on Aug. 12, was assigned to Monolithic 3D Inc. (Klamath Falls, Ore.).

"3D semiconductor device and structure with logic and memory" was invented by Zvi Or-Bach (Haifa, Israel) and Jin-Woo Han (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D semiconductor device including: a first level including a single crystal layer and a memory control circuit including first transistors and a redundancy control circuit; a first metal layer overlaying the single crystal layer; a second metal layer overlaying the first metal layer; a third metal layer overlaying the second metal layer; second transistors disposed atop the third met...