ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,509,557, issued on Dec. 30, was assigned to MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC (Tokyo).
"Thermally conductive polysiloxane compositions" was invented by Atsushi Sakamoto (Tokyo) and Sean Conte (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thermally conductive polysiloxane composition includes (A) a thermally conductive filler and (B) one or more compounds selected from an alkoxysilyl group-containing compound and a dimethylpolysiloxane, wherein: component (A) includes (A-1) round, indefinite-shaped or polyhedral aluminum nitride particles having an average particle diameter of from 50 micro metre to 150 micro metre and (A-2) round, inde...