US Patent Issued to Molex on Oct. 14 for "Package structure having photonic integrated circuit" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,442,994, issued on Oct. 14, was assigned to Molex LLC (Lisle, Ill.).

"Package structure having photonic integrated circuit" was invented by Chih-Chung Hsu (Zhubei, Taiwan), Chih-Chung Wu (Hsinchu, Taiwan) and Zuon-Min Chuang (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to th...