US Patent Issued to Molex on June 10 for "High density receptacle" (Illinois Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,947, issued on June 10, was assigned to Molex LLC (Lisle, Ill.).

"High density receptacle" was invented by Hazelton Avery (Batavia, Ill.) and Kent E. Regnier (Lombard, Ill.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A receptacle is depicted. The receptacle can provide two rows of terminals to increase the density of the interface. If desired, a connector positioned in the receptacle can omit the use of a housing, even if the receptacle provides a stacked connector configuration. With the use of various airflow features it is possible to cool inserted plug modules that use more than 6 watts and potentially more than 8 watts of power."

The patent...