ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,157, issued on April 15, was assigned to Molex LLC (Lisle, Ill.).
"Heat radiator and electronic component module" was invented by Tetsunori Tsumuraya (Yamato, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The invention comprises: a thermally conductive plate; and a resin coating integrated with the thermally conductive plate so as to cover at least a portion of the surface of the thermally conductive plate, wherein the resin coating includes a ventilation cylinder through which ventilation holes passing through the thermally conductive plate and the resin coating, and wherein at least a portion of the thermally conductive plate is housed insid...