ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,221,569, issued on Feb. 11, was assigned to MODU TECH Co. LTD. (Gyeonggi-do, South Korea).
"Adhesive tape for semiconductor package manufacturing process, and method for manufacturing same" was invented by Byeong Yeon Choi (Gyeonggi-do, South Korea), Seung Yol Lee (Gyeonggi-do, South Korea), Suk Hee Kang (Gyeonggi-do, South Korea) and Gyung Ju Yoon (Gyeonggi-do, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an adhesive tape for a semiconductor package manufacturing process. The adhesive type includes: a first adhesive layer formed on a first base film; a second base film formed on the first adhesive layer, in which the second ba...