US Patent Issued to MODU TECH on April 15 for "Adhesive tape for semiconductor package manufacturing process and method for manufacturing same" (South Korean Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,275,867, issued on April 15, was assigned to MODU TECH Co. LTD. (Gyeonggi-do, South Korea).

"Adhesive tape for semiconductor package manufacturing process and method for manufacturing same" was invented by Byeong Yeon Choi (Gyeonggi-do, South Korea), Seung Yol Lee (Gyeonggi-do, South Korea), Suk Hee Kang (Gyeonggi-do, South Korea) and Gyung Ju Yoon (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an adhesive tape for a semiconductor manufacturing process, the adhesive tape being attached on a lower surface of a semiconductor package on which a plurality of protrusion electrodes are formed. The adh...