US Patent Issued to MITSUI MINING & SMELTING on Oct. 28 for "Roughened copper foil, copper-cladded laminate board, and printed wiring board" (Japanese, Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,457,686, issued on Oct. 28, was assigned to MITSUI MINING & SMELTING Co. LTD. (Tokyo).

"Roughened copper foil, copper-cladded laminate board, and printed wiring board" was invented by Ayumu Tateoka (Nantou, Taiwan), Ryosuke Kaneyama (Nantou, Taiwan), Yasuji Hara (Ageo, Japan), Yasuo Sato (Ageo, Japan), Shinichi Obata (Ageo, Japan) and Chun Chieh Li (Nantou, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and high peel strength when used for a copper-clad laminate or a printed wiring board. This roughened copper foil includes a roughened surface on ...