ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,354, issued on May 13, was assigned to MITSUI MINING & SMELTING Co. LTD. (Tokyo).

"Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor" was invented by Yoshihiro Yoneda (Ageo, Japan), Toshihiro Hosoi (Ageo, Japan), Kenshiro Fukuda (Ageo, Japan) and Toshifumi Matsushima (Ageo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition for use in a dielectric layer of a capacitor is provided that can control a decrease in capacitance or dielectric constant at high temperature and ensure high dielectric characteristics and high adhesion of t...