US Patent Issued to MITSUI MINING & SMELTING on May 13 for "Production method for multilayer wiring board" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,504, issued on May 13, was assigned to MITSUI MINING & SMELTING Co. LTD. (Tokyo).

"Production method for multilayer wiring board" was invented by Yoshinori Matsuura (Ageo, Japan), Takenori Yanai (Ageo, Japan) and Toshimi Nakamura (Ageo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a multilayer wiring board is disclosed, the method being capable of separating a substrate without large local warpage of the multilayer wiring layer and thereby improving the reliability of connection in the multilayer wiring layer. This method includes providing a laminated sheet having, in sequence, a substrate, a first release layer an...