ALEXANDRIA, Va., June 19 -- United States Patent no. 12,331,182, issued on June 17, was assigned to MITSUI MINING & SMELTING Co. LTD. (Tokyo).
"Resin composition and resin-attached copper foil" was invented by Kazuhiro Oosawa (Ageo, Japan), Haruka Makino (Ageo, Japan) and Kuniharu Ogawa (Ageo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a resin composition including (a) an acrylic polymer having a tensile modulus of 200 MPa or less, (b) a resin that is solid at 25deg C., (c) a resin that is liquid at 25deg C. and crosslinkable with at least one of the component (a) or the component (b), and (d) a polymerization initiator. The content of the component (a) is 35 parts by weight or mo...