US Patent Issued to MITSUI MINING & SMELTING on June 17 for "Resin composition, copper foil with resin, and printed wiring board" (Japanese, Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,331,212, issued on June 17, was assigned to MITSUI MINING & SMELTING Co. LTD. (Tokyo).

"Resin composition, copper foil with resin, and printed wiring board" was invented by Kazuhiro Oosawa (Ageo, Japan), Ayumu Tateoka (Nantou, Taiwan), Kuniharu Ogawa (Ageo, Japan) and Haruka Makino (Ageo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water-resistant reliability. This resin composition includes an arylene ether compound having a weight average molecular weight of 30000 or higher and a styrenic c...