US Patent Issued to MITSUI MINING & SMELTING on July 8 for "Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor" (Japanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,351,698, issued on July 8, was assigned to MITSUI MINING & SMELTING Co. LTD. (Tokyo).

"Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor" was invented by Toshihiro Hosoi (Ageo, Japan), Kenshiro Fukuda (Ageo, Japan), Yoshihiro Yoneda (Ageo, Japan), Tomohiro Ishino (Ageo, Japan) and Tetsuro Sato (Ageo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a resin composition that can greatly improve voltage endurance while ensuring high capacitance and excellent circuit adhesion, when used as the dielectric layer of a capacitor. This resin ...