ALEXANDRIA, Va., July 3 -- United States Patent no. 12,344,953, issued on July 1, was assigned to MITSUI MINING & SMELTING Co. LTD. (Tokyo).
"Electrolytic copper foil" was invented by Daisuke Nakajima (Ageo, Japan), Yasuji Hara (Ageo, Japan), Mitsuyoshi Matsuda (Ageo, Japan) and Mitsuhiro Wada (Ageo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an electrodeposited copper foil having high smoothness and at the same time exhibiting high flexibility (particularly, high flexibility after annealing at 180deg C. for 1 hour) suitable for a flexible substrate. This electrodeposited copper foil has a ten-point average roughness Rz of 0.1 micro metre or larger and 2.0 micro metre or smaller on at l...