US Patent Issued to MITSUI MINING & SMELTING on Jan. 13 for "Manufacturing methods for copper-clad laminate and printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,929, issued on Jan. 13, was assigned to MITSUI MINING & SMELTING Co. LTD. (Tokyo).

"Manufacturing methods for copper-clad laminate and printed wiring board" was invented by Daisuke Nakajima (Ageo, Japan) and Shota Kawaguchi (Ageo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method for manufacturing a copper-clad laminate in which a copper foil and a resin are joined together with high heat-resistant adhesion force though a fluororesin, which is a low dielectric constant thermoplastic resin, is used. This method includes providing a surface-treated copper foil including a copper foil and a zinc-containing layer on at least one ...