US Patent Issued to Mitsui Mining & Smelting on Feb. 25 for "Composition for pressure bonding, and bonded structure of conductive bodies and production method therefor" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,233,463, issued on Feb. 25, was assigned to Mitsui Mining & Smelting Co. Ltd. (Japan).

"Composition for pressure bonding, and bonded structure of conductive bodies and production method therefor" was invented by Kei Anai (Ageo, Japan), Shinichi Yamauchi (Ageo, Japan) and Jung-Lae Jo (Ageo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composition for pressure bonding contains a metal powder and a solid reducing agent and has a compressibility of 10% to 90%, the compressibility being expressed by a relationship formula using the thickness A of a dried coating film formed by drying the composition in an air atmosphere at 110deg C. under atmospher...