US Patent Issued to MITSUI CHEMICALS on March 25 for "Method of manufacturing substrate layered body and layered body" (Japanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,143, issued on March 25, was assigned to MITSUI CHEMICALS INC. (Tokyo).

"Method of manufacturing substrate layered body and layered body" was invented by Yasuhisa Kayaba (Urayasu, Japan), Jun Kamada (Narashino, Japan) and Yuzo Nakamura (Chiba, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a substrate layered body includes: a step of applying a bonding material to the surface of at least one of a first substrate or a second substrate; a step of curing the bonding material applied on the surface to form a bonding layer having a reduced modulus at 23deg C. of 10 GPa or less; and a step of bonding the first substrate an...