ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,640, issued on Oct. 14, was assigned to MITSUI CHEMICALS ICT MATERIA INC. (Tokyo).
"Method for manufacturing electronic device" was invented by Hiroto Yasui (Sodegaura, Japan), Hiroyoshi Kurihara (Nagoya, Japan) and Jin Kinoshita (Nagoya, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing an electronic device includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side, and a step (C) of irradiati...