ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,421,423, issued on Sept. 23, was assigned to MITSUBISHI Corp. (Tokyo).
"Polishing method, machine device manufacturing method, and machine device" was invented by Ryuji Monden (Tokyo) and Kunio Kondo (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "One aspect of the present invention provides a polishing method including polishing a sliding part of a machine device by producing fullerene-aggregated particles by making the sliding part slide while a polishing-agent composition containing fullerenes and a solvent of the fullerenes is applied to the sliding part."
The patent was filed on April 27, 2020, under Application No. 17/757,384.
*For furthe...