US Patent Issued to Mitsubishi Materials on July 15 for "Copper alloy, plastically worked copper alloy material, component for electronic/electrical equipment, terminal, heat dissipation substrate" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,284, issued on July 15, was assigned to Mitsubishi Materials Corp. (Tokyo).

"Copper alloy, plastically worked copper alloy material, component for electronic/electrical equipment, terminal, heat dissipation substrate" was invented by Hirotaka Matsunaga (Kitamoto, Japan), Kosei Fukuoka (Kitamoto, Japan), Kazunari Maki (Kitamoto, Japan), Kenji Morikawa (Aizuwakamatsu, Japan), Shinichi Funaki (Aizuwakamatsu, Japan) and Hiroyuki Mori (Sakai, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This copper alloy contains 10-100 mass ppm of Mg, with a balance being Cu and inevitable impurities, which comprise; 10 mass ppm or less of S, 10 mass ppm or less...