US Patent Issued to Mitsubishi Materials on Feb. 10 for "Copper/ceramic assembly, insulating circuit substrate, production method for copper/ceramic assembly, and production method for insulating circuit substrate" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,731, issued on Feb. 10, was assigned to Mitsubishi Materials Corp. (Tokyo).

"Copper/ceramic assembly, insulating circuit substrate, production method for copper/ceramic assembly, and production method for insulating circuit substrate" was invented by Nobuyuki Terasaki (Saitama, Japan) and Akira Sakurai (Saitama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This copper/ceramic assembly includes: a copper member consisting of copper or a copper alloy; and a ceramic member, wherein the copper member and the ceramic member are bonded to each other. At a bonded interface between the ceramic member and the copper member, an active metal compound l...