US Patent Issued to Mitsubishi Materials on April 29 for "Pure copper material, insulating substrate, and electronic device" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,698, issued on April 29, was assigned to Mitsubishi Materials Corp. (Tokyo).

"Pure copper material, insulating substrate, and electronic device" was invented by Takumi Odaira (Kitamoto, Japan), Yuki Ito (Kitamoto, Japan), Kenichiro Kawasaki (Kitamoto, Japan) and Kazunari Maki (Kitamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This pure copper material includes Cu in an amount of 99.9 mass % or more and 99.999 mass % or less, an average crystal grain size in a rolled surface is 10 micro metre or more, and when a measurement area of 1 mm2 or more is measured by an EBSD method at a measurement interval of 1 micro metre, measurement points a...