US Patent Issued to Mitsubishi Materials on April 22 for "Slit copper material, part for electric/electronic device, bus bar, heat dissipation substrate" (Japanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,281,376, issued on April 22, was assigned to Mitsubishi Materials Corp. (Tokyo).

"Slit copper material, part for electric/electronic device, bus bar, heat dissipation substrate" was invented by Hirotaka Matsunaga (Kitamoto, Japan), Kosei Fukuoka (Kitamoto, Japan) and Kazunari Maki (Kitamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A slit copper material comprises 99.96% by mass or greater of Cu. In this slit copper material, a ratio W/t of a plate width W to a plate thickness t is 10 or greater, an electrical conductivity is 97.0% IACS or greater, a ratio B/A of an average crystal grain size B in a plate surface layer portion to an average c...